Intel will help the U.S. Navy with the development of systems microelectromechanical Solovyov | 15.10.2020
Intel Corporation has entered into with the naval fleet agreement, implying its participation in the project State-of-the-Art Heterogeneous Integration Prototype (SHIP). The amount of the contract, in accordance
which Intel will help the military to develop prototypes of improved circuits for the army, is unknown.
The Heterogeneous integrated packaging solution allows you to create an affordable, space saving and flexible system solutions, integrating multiple highly complex circuits or components in one package
(system in package, SiP) and thereby uniting the maximum number of functions. It is expected that progress will be achieved reduction of the physical dimensions of the electronic device, increasing its
performance and reliability, and reduced energy consumption.
According to information from open sources, engineers of the U.S. Navy intend to develop advanced prototype SHIP, demonstrating a new approach to a safe, measurable and cost
the effective design of such devices. During implementation of the project will involve innovative techniques, including new design tools, production and testing. On the second
phase of the project, according to experts, will be developed a prototype multichip packages and of the work done on standards, interfaces, and security protocols for heterogeneous systems.
It is also reported that all development and testing must comply with international trade regulations weapons (ITAR).
In the end, the US army intends to develop better microelectronic devices for their needs. The execution of the contract control Department Crane Division Center for operational use
the surface forces of the U.S. Navy.
Participation in the project of Intel Corporation assumes her help in developing the prototype circuits for the US Navy using advanced products – own packaging technology of semiconductors at plants in
Arizona and Oregon.
Electronics
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